01005 – our current standard.
Ahead on technology
In 2002 we have engaged in pioneering work for the European market with lead-free processing of the smallest components which could be assembled (0201) at that time. We were among the first companies in the world to process these components for the automotive sector and to master every aspect of the entire production process. We were the first in the world having systems which could reliably carry out process-integrated inspection of solder joints on these components.
Today DELTEC is also able to assemble 01005 components in series.
Assembling printed circuit boards
In addition to 01005 components, which currently constitute the most exacting boundary for process mastery, we also offer conventional chip assembly, processing of (µ-)BGA and the use of flip-chip technologies in our range of services.
From chip processing to process-supportive inspection during all stages of operations, we master all these procedures perfectly. Our own demands for innovation and continuing development drive us on every day. With our professional technology, highly qualified employees and outstanding productivity, we are equipped for the future and ready for new challenges.
• Since 2002 europe-wide
in lead-free processing of the smallest
components (0201) which could be
assembled at that time
• The first systems in the world for
process-integrated inspection of
solder joints on 0201 components
• Conventional chip assembly,
processing of (µ-)BGA and use of
• Process mastery at all levels
• 25 assembling machines in
6 SMD lines
• 7 in-line paste printers
• 3 high-speed glue machines
• smallest pitch: 0.35 mm
• smallest component: 01005
• biggest component: 150 mm pin strip
• Assembly capacity per month:
140 million components
• 1 axial assembly machine
• 2 radial assembly machines
• 3 pressing machines
• Manual assembly